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Ceramic Packages

Chip Scale Package

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Saw Filter 적용
Cell Size (1109, 1411, 1511, 1814, 2016)

1. PLATING : ELECTRO Ni - 1.27 ~ 8.89㎛ (S/P) / ELECTRO Au - 0.50 ~ 1.00㎛ (S/P)
2. WARPAGE : 700㎛ Max.
3. MISALTIGNMENT BETWEEN LAYER MP2F AND MP1B SHALL BE 75㎛ Max.
4. STRAIGHTENESS SHALL BE 70㎛ Max.
5. COPLANATITY SHALL BE 15㎛ Max.

RW CS1814

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RW CS1411

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RW CS1511

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RW CS2016

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RW CS1109

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